PCB Design

Substrates High Temp FR4 Polyimide N4000-13 and -13SI GEtek Rogers 4000 Series (4003, 4350, 4450DX) Cyanate Ester LPI Soldermask (Red, Blue, Green) Photo Imaged Silkscreen (White, Red, Yellow, Blue, Black, Green) Nickel and Gold Plating Processes Mixed Dielectrics Buried/Blind Vias Sequential & Cap Lamination Via-in-Pad (Filled & Plated Vias) Vacuum Sealed Vias Depth Drilling (Back-Drilling) Depth Plating Capabilities 52 + Layers Thin Cores (2mil) High Aspect Ratios (30:1) Micro-Drilling (5mil) Fine Line (3mil) Fine Pitch Micro-Drilling and Imaging Testing IPC Netlist Testing Gerber/CAM data checking PCB Verification Flying Probe Tester Fixtureless Hi-Pot Measurement Impedance Measurement +/- 5% of Target Differential/Single-ended Measurement